George E. Ponchak received the B. E. E. degree from Cleveland State University, Cleveland, OH in 1983, the M.S.E.E. degree from Case Western Reserve University, Cleveland, OH in 1987, and the Ph.D. in electrical engineering from the University of Michigan, Ann Arbor, MI in 1997.

He joined the staff of the Communication Technology Division at NASA Glenn Research Center, Cleveland, OH in 1983 where he is now a senior research engineer. In 1997-1998 and in 2000-2001, he was a visiting lecturer at Case Western Reserve University in Cleveland, OH. He has authored and co-authored 115 papers in refereed journals and symposia proceedings. His research interests include the development and characterization of microwave and millimeter-wave printed transmission lines and passive circuits, multilayer interconnects, uniplanar circuits, Si and SiC Radio Frequency Integrated Circuits, and microwave packaging.

Dr. Ponchak is a senior member of the IEEE Microwave Theory and Techniques Society (MTT-S), a member of the International Microelectronics and Packaging Society (IMAPS), and an Associate Member of the European Microwave Association. Dr. Ponchak was Editor of a special issue of IEEE Trans. on Microwave Theory and Techniques on Si MMICs. He founded the IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems and served as its Chair in 1998, 2001, and 2006 and it’s Digest Editor in 2000 and 2003. He founded the Cleveland MTT-S/AP-S Chapter and serves as its Chair. He has chaired many MTT-S International Microwave Symposium workshops and special sessions. He is a member of the IEEE International Microwave Symposium Technical Program Committee on Transmission Line Elements and served as its Chair in 2003-2005, a member of IEEE MTT-S AdCom Membership Services Committee, and a member of the IEEE MTT-S Technical Committee 12 on Microwave and Millimeter-Wave Packaging and Manufacturing. He received the Best Paper of the ISHM’97 30th International Symposium on Microelectronics Award.